@incollection{Wang16,
author = {Yangang Wang and Xiaoping Dai and Guoyou Liu and Yibo Wu and Yun Li and
Steve Jones},
title = {Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles},
booktitle = {Modeling and Simulation for Electric Vehicle Applications},
publisher = {IntechOpen},
address = {Rijeka},
year = {2016},
editor = {Mohamed Amine Fakhfakh},
chapter = {2},
doi = {10.5772/64173},
url = {https://doi.org/10.5772/64173}
}