@incollection{Lin16,
author = {Professor Wei-Keng Lin},
title = {Theoretical Derivation of Junction Temperature of Package Chip},
booktitle = {Electronics Cooling},
publisher = {IntechOpen},
address = {Rijeka},
year = {2016},
editor = {S M Sohel Murshed},
chapter = {8},
doi = {10.5772/62570},
url = {https://doi.org/10.5772/62570}
}