@incollection{Li13,
author = {Jue Li and Tomi Laurila and Toni T. Mattila and Hongbo Xu and Mervi Paulasto- Kröcke},
title = {Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling},
booktitle = {Recent Developments in the Study of Recrystallization},
publisher = {IntechOpen},
address = {Rijeka},
year = {2013},
editor = {Peter Wilson},
chapter = {3},
doi = {},
url = {https://doi.org/}
}