@incollection{Tan12,
author = {Ji Fan and Chuan Seng Tan},
title = {Low Temperature Wafer-Level Metal Thermo-Compression Bonding Technology for 3D Integration},
booktitle = {Metallurgy},
publisher = {IntechOpen},
address = {Rijeka},
year = {2012},
editor = {Yogiraj Pardhi},
chapter = {4},
doi = {10.5772/48216},
url = {https://doi.org/10.5772/48216}
}