@incollection{Hsu10,
author = {Hsiang-Chen Hsu and Chin-Yuan Hu and Wei-Yao Chang and  Chang-Lin Yeh and Yi-Shao Lai},
title = {Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding},
booktitle = {Finite Element Analysis},
publisher = {IntechOpen},
address = {Rijeka},
year = {2010},
editor = {David Moratal},
chapter = {20},
doi = {10.5772/intechopen.83992},
url = {https://doi.org/10.5772/intechopen.83992}
}