Open access peer-reviewed chapter

Material Characterization and Failure Analysis for Microelectronics Assembly Processes

By Chien-Yi Huang, Ming-Shu Li, Shan-Yu Huang, Cheng-I Chang and Min-Hui Huang

Submitted: November 27th 2010Reviewed: May 31st 2011Published: November 9th 2011

DOI: 10.5772/23532

Downloaded: 6714

© 2011 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Chien-Yi Huang, Ming-Shu Li, Shan-Yu Huang, Cheng-I Chang and Min-Hui Huang (November 9th 2011). Material Characterization and Failure Analysis for Microelectronics Assembly Processes, Wide Spectra of Quality Control Isin Akyar, IntechOpen, DOI: 10.5772/23532. Available from:

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