Open access peer-reviewed chapter

The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials

By Daniel J. Cook, Matthew S. Yeager, Shamik Chakraborty, Donald M. Whiting and Boyle C. Cheng

Submitted: May 25th 2011Reviewed: October 10th 2011Published: March 28th 2012

DOI: 10.5772/36742

Downloaded: 2389

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Daniel J. Cook, Matthew S. Yeager, Shamik Chakraborty, Donald M. Whiting and Boyle C. Cheng (March 28th 2012). The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials, Thermoplastic Elastomers, Adel Zaki El-Sonbati, IntechOpen, DOI: 10.5772/36742. Available from:

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