Open access peer-reviewed chapter

Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

By Sombel Diaham, Marie-Laure Locatelli and Zarel Valdez-Nava

Submitted: December 6th 2010Reviewed: May 23rd 2011Published: October 10th 2011

DOI: 10.5772/24397

Downloaded: 2617

© 2011 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Sombel Diaham, Marie-Laure Locatelli and Zarel Valdez-Nava (October 10th 2011). Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials, Silicon Carbide - Materials, Processing and Applications in Electronic Devices, Moumita Mukherjee, IntechOpen, DOI: 10.5772/24397. Available from:

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