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Materials Science » "Recrystallization", book edited by Krzysztof Sztwiertnia, ISBN 978-953-51-0122-2, Published: March 7, 2012 under CC BY 3.0 license. © The Author(s).

Chapter 8

The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections

By Toni T. Mattila and Jorma K. Kivilahti
DOI: 10.5772/37899