Open access peer-reviewed chapter

Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling

By Jue Li, Tomi Laurila, Toni T. Mattila, Hongbo Xu and Mervi Paulasto- Kröcke

Submitted: May 22nd 2012Reviewed: September 26th 2012Published: February 6th 2013

DOI: 10.5772/53820

Downloaded: 1436

© 2013 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Jue Li, Tomi Laurila, Toni T. Mattila, Hongbo Xu and Mervi Paulasto- Kröcke (February 6th 2013). Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling, Recent Developments in the Study of Recrystallization Peter Wilson, IntechOpen, DOI: 10.5772/53820. Available from:

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