Open access peer-reviewed Edited Volume

Novel Metal Electrodeposition and the Recent Application

Edited by Masato Sone

Tokyo Institute of Technology

Co-editor:

Kazuya Masu

Tokyo Institute of Technology

Gold and noble metals have been attractive to humans from ancient times because of their beautiful features. In modern society, noble metals, especially gold, play important roles as components in electronic devices because of their high electrical conductivity, chemical stability, and density. In the field of MEMS devices, the demand for continuous miniaturization and sensitivity enhancement is always high. Especially for MEMS accelerometers, sensitivity is affected by Brownian noise, and components with sufficient mass are needed to suppress this noise. Therefore, it is difficult to reduce the dimensions of components to allow further miniaturization of the device. This book presents recent progress in noble metal electrodeposition and applications of gold-based materials in the realization of highly sensitive CMOS-MEMS accelerometers.

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Novel Metal Electrodeposition and the Recent ApplicationEdited by Masato Sone

Published: March 6th 2019

DOI: 10.5772/intechopen.73382

ISBN: 978-1-78985-296-7

Print ISBN: 978-1-78985-295-0

Copyright year: 2019

Books open for chapter submissions

669 Total Chapter Downloads

chaptersDownloads

Open access peer-reviewed

1. Evaluation Methods of Mechanical Properties of Micro-Sized Specimens

By Takashi Nagoshi, Tso-Fu Mark Chang

48

Open access peer-reviewed

2. Morphology Controlled Synthesis of the Nanostructured Gold by Electrodeposition Techniques

By Brij Mohan Mundotiya and Wahdat Ullah

136

Open access peer-reviewed

3. Cu Wiring Fabrication by Supercritical Fluid Deposition for MEMS Devices

By Eiichi Kondoh

63

Open access peer-reviewed

4. Pulse-Current Electrodeposition of Gold

By Chun-Yi Chen, Masaharu Yoshiba, Haochun Tang, Tso-Fu Mark Chang, Takashi Nagoshi, Daisuke Yamane, Toshifumi Konishi and Katsuyuki Machida

47

Open access peer-reviewed

5. Electrodeposition of Gold Alloys and the Mechanical Properties

By Haochun Tang, Tso-Fu Mark Chang, Chun-Yi Chen, Takashi Nagoshi, Daisuke Yamane, Toshifumi Konishi and Katsuyuki Machida

60

Open access peer-reviewed

6. Hard Pure-Gold and Gold-CNT Composite Plating Using Electrodeposition Technique with Environmentally Friendly Sulfite Bath

By Masatsugu Fujishige and Susumu Arai

130

Open access peer-reviewed

7. Electrodeposition of High-Functional Metal Oxide on Noble Metal for MEMS Devices

By Wan-Ting Chiu, Chun-Yi Chen, Tso-Fu Mark Chang, Tomoko Hashimoto and Hiromichi Kurosu

101

Open access peer-reviewed

8. Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass

By Katsuyuki Machida,Toshifumi Konishi, Daisuke Yamane, Hiroshi Toshiyoshi and Hiroyuki Ito

84

Edited Volume and chapters are indexed in

  • Worldcat
  • OpenAIRE
  • Google Scholar
  • AZ ebsco
  • Base
  • CNKI
  • IET Inspec

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