Open access peer-reviewed chapter

ACF Curing Process Optimization for Chip-on-Glass (COG) Considering Mechanical and Electrical Properties of Joints

By Bo Tao, Han Ding, Zhouping Yin and Youlun Xiong

Published: November 1st 2009

DOI: 10.5772/9688

Downloaded: 5426

© 2009 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution-NonCommercial-ShareAlike-3.0 License, which permits use, distribution and reproduction for non-commercial purposes, provided the original is properly cited and derivative works building on this content are distributed under the same license.

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Bo Tao, Han Ding, Zhouping Yin and Youlun Xiong (November 1st 2009). ACF Curing Process Optimization for Chip-on-Glass (COG) Considering Mechanical and Electrical Properties of Joints, New Developments in Liquid Crystals Georgiy V Tkachenko, IntechOpen, DOI: 10.5772/9688. Available from:

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