Open access peer-reviewed chapter

Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated Circuit and Packaging Applications

By Vasarla Nagendra Sekhar

Submitted: November 23rd 2011Reviewed: September 9th 2012Published: October 17th 2012

DOI: 10.5772/53198

Downloaded: 6248

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Vasarla Nagendra Sekhar (October 17th 2012). Mechanical Characterization of Black Diamond (Low-k) Structures for 3D Integrated Circuit and Packaging Applications, Nanoindentation in Materials Science Jiri Nemecek, IntechOpen, DOI: 10.5772/53198. Available from:

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