Open access peer-reviewed chapter

Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

By Yangang Wang, Xiaoping Dai, Guoyou Liu, Yibo Wu, Yun Li and Steve Jones

Submitted: November 24th 2015Reviewed: May 10th 2016Published: October 5th 2016

DOI: 10.5772/64173

Downloaded: 1513

© 2016 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Yangang Wang, Xiaoping Dai, Guoyou Liu, Yibo Wu, Yun Li and Steve Jones (October 5th 2016). Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles, Modeling and Simulation for Electric Vehicle Applications Mohamed Amine Fakhfakh, IntechOpen, DOI: 10.5772/64173. Available from:

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