Open access peer-reviewed chapter

Low Temperature Wafer-Level Metal Thermo-Compression Bonding Technology for 3D Integration

By Ji Fan and Chuan Seng Tan

Submitted: November 14th 2011Reviewed: March 26th 2012Published: September 19th 2012

DOI: 10.5772/48216

Downloaded: 3361

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Ji Fan and Chuan Seng Tan (September 19th 2012). Low Temperature Wafer-Level Metal Thermo-Compression Bonding Technology for 3D Integration, Metallurgy Yogiraj Pardhi, IntechOpen, DOI: 10.5772/48216. Available from:

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