Open access peer-reviewed Edited Volume

Lead Free Solders

Edited by Abhijit Kar

Jagadis Bose National Science Talent Search

This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

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Lead Free SoldersEdited by Abhijit Kar

Published: October 2nd 2019

DOI: 10.5772/intechopen.76955

ISBN: 978-1-78985-460-2

Print ISBN: 978-1-78985-459-6

eBook (PDF) ISBN: 978-1-83962-278-6

Copyright year: 2019

Books open for chapter submissions

2701 Total Chapter Downloads

2 Crossref Citations

1 Web of Science Citations

2 Dimensions Citations


Open access peer-reviewed

1. Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered Thin Film of Sn on the Lead-Free Solder Joint Interface

By Monalisa Char and Abhijit Kar


Open access peer-reviewed

2. Role of Intermetallics in Lead-Free Alloys

By Dattaguru Ananthapadmanaban and Arun Vasantha Geethan


Open access peer-reviewed

3. Soldering by the Active Lead-Free Tin and Bismuth-Based Solders

By Roman Koleňák, Martin Provazník and Igor Kostolný


Open access peer-reviewed

4. Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

By Mitsuhiro Watanabe and Eiichi Kondoh


Open access peer-reviewed

5. A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints

By Shuye Zhang, Tiesong Lin, Peng He and Kyung-Wook Paik


Edited Volume and chapters are indexed in

  • Worldcat
  • OpenAIRE
  • Google Scholar
  • AZ ebsco
  • Base
  • CNKI

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