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Computer and Information Science » Numerical Analysis and Scientific Computing » "Finite Element Analysis", book edited by David Moratal, ISBN 978-953-307-123-7, Published: August 17, 2010 under CC BY-NC-SA 3.0 license. © The Author(s).

Chapter 20

Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding

By Hsiang-Chen Hsu, Chin-Yuan Hu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai