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Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding

By Hsiang-Chen Hsu, Chin-Yuan Hu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai

Published: August 17th 2010

Downloaded: 3385

© 2010 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution-NonCommercial-ShareAlike-3.0 License, which permits use, distribution and reproduction for non-commercial purposes, provided the original is properly cited and derivative works building on this content are distributed under the same license.

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Hsiang-Chen Hsu, Chin-Yuan Hu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai (August 17th 2010). Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding, Finite Element Analysis David Moratal, IntechOpen, DOI: null. Available from:

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